Dive Brief:
- A massive megaproject, staffed by crews from three major U.S. contractors, has begun construction. Micron Technology poured the first concrete for its $100 billion semiconductor campus in Clay, New York, according to July 9 news releases from the company and contractor Gilbane.
- The milestone marks the transition from site preparation to vertical construction for the project that also includes Jacobs and Bechtel, more than one quarter ahead of the original schedule, according to Gilbane.
- The chipmaker, in partnership with Gilbane, has directed about $675 million, more than half of the total awarded value to date, to New York-based contractors, suppliers and subcontractors, according to the Micron release.
Dive Insight:
The first concrete pour comes about a month after Micron tapped Bechtel as the engineering, procurement and construction partner for the project’s first phase.
Gilbane has overseen preconstruction since August 2025, when the Providence, Rhode Island-based contractor won the contract to prepare the ground for the site. Jacobs serves as the architectural and engineering design partner, according to Micron.
Once complete, the campus will be the largest semiconductor manufacturing site in U.S. history, according to the chipmaker. The campus will consist of up to four fabs, according to Micron, and will support the chip giant’s goal of producing 40% of its DRAM in the U.S.
“Today’s milestone marks another major step for Micron in Central New York, and what makes it even more remarkable is that we’re here in July — months ahead of schedule — pouring the concrete foundation,” New York Gov. Kathy Hochul said in the Micron news release. “This is the largest private investment in New York State history.”
The chipmaker also raised its planned U.S. investment from $200 billion to more than $250 billion through 2035, according to the company news release. The New York campus is the cornerstone of that investment plan, though additional investments will also go toward its site in Boise, Idaho. Micron expects first wafer output at its first Idaho plant in mid-2027 and late 2028 for the second plant, according to the release.
